This acidic suspension provides exceptional chemical-mechanical polishing, delivering superior surface finishes on materials such as germanium, silicon, arsenide, zinc sulfide, fluorides, sapphire, ferrites, and silicon carbide. It also produces low-scatter finishes on pure metals like nickel, tungsten, copper, and beryllium, as well as steel and aluminum. Even epoxy resin materials and plastics can be polished effectively with this versatile colloidal suspension. Properties include a pH range of 3 to 3.5, 20% solids content, and thixotropic viscosity.

This medium polish suspension is designed for high-performance mechanochemical polishing, offering exceptional removal rates and superior surface finishes. It chemically interacts with ceramic materials, enhancing the efficiency of abrasive cutting. Ideal for polishing aluminum, glass, sapphire, silicon nitride, and metal/ceramic composites. Properties include a pH of 9 for optimal performance.

An alkaline suspension formulated to eliminate issues like drying or freezing common with other colloidal silica products. It is the premier choice for chemical-mechanical polishing, delivering ultra-fine finishes on oxides, metals, semiconductors, and ceramic-based materials such as silicon, fused silica, lithium niobate, YAG, and sapphire. Its fine particle size and aggressive polishing action ensure precision results. Properties include a pH range of 9.6 to 9.9, 40% solids content, and a viscosity of 20 to 40 cps.