Diamond Wafering & Cut-Off Blades
CUTTING EDGE offers a range of high-performance diamond wafering and cut-off blades tailored for various applications:
Featuring a single layer of abrasive on a solid steel core, these blades provide aggressive cutting performance, ideal for composite materials like ceramics, glass, sapphire, and rock. However, due to the single abrasive layer, the blade's lifespan is limited.
Engineered with a hard bond, these blades are perfect for cutting tough materials such as ceramics, refractories, glass, and rock. With an abrasive depth of approximately 1/8”, they provide durability and precision. Lower abrasive concentrations allow freer cutting, while higher concentrations are suited for particularly aggressive materials.
Designed with a softer, more forgiving bond matrix, Resin Bond blades excel at cutting hard, dense materials like carbide. They deliver a superior finish compared to electroplated or metal bond blades and are commonly used in high-concentration cutting and slicing operations for optimal performance.